—Product Description
Grade Copper (Cu) Oxygen (O) Other Elements Notes
C10100 ≥99.99% ≤0.0005% Silver (Ag) ≤0.0015%, ultra-low impurities High-purity oxygen-free copper, used in high-vacuum/low-temperature environments
C10200 ≥99.95% ≤0.001% Total impurities ≤0.03% Oxygen-free copper (OFHC), general high-conductivity applications
C11000 ≥99.90% ≤0.02% Phosphorus-free deoxidized Electrolytic tough pitch copper (ETP), common electrical conductors
Key Differences:
Oxygen Content: C10100 has the lowest oxygen content (≤0.0005%) to avoid hydrogen embrittlement; C12200 uses phosphorus deoxidation to enhance weldability.
Impurity Control: C10100/C10200 impose stricter limits on impurities like silver and sulfur to ensure high purity.
Grade Condition Tensile Strength (MPa) Yield Strength (MPa) Elongation (%) Hardness (HV)
C10100 Annealed 200-250 70-100 ≥40 40-60
C10200 Annealed 200-240 60-90 ≥45 35-55
C11000 Annealed 210-260 80-110 ≥35 45-65
Notes:
Cold Working (Hard Condition): Significantly increases strength but reduces plasticity (e.g., C10100 hard condition elongation is only 10-15%).
C12200: Slightly higher annealed strength than C10100/C10200 due to phosphorus content, but lower conductivity.
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